Flash Extractor用户手册-BGA chip reballing – 成都千喜数据恢复中心
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Flash Extractor用户手册-BGA chip reballing

BGA chip reballing

1. Clean up the pads on the chip from residues of solder

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2. Use BGA balls like shown on picture or the same. Diameter must be not less than 0.4mm and not more than 0.45mm

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3. Use BGA Gel flux like shown on picture or the same

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4. Apply a thin layer of flux over the entire surface of the contact group Remove excess flux.

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5. Place balls on the pads by a thin pair of tweezers. Make sure the balls not roll from the pads, and not stick together/other

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6. Use hot air gun to the bottom of chip. Set temperature 300-310° C. Do not expose the air stream onto the working surface!

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7. After the warm-up by heating gun balls will be placed at the contact pads by themselves. Remove excess of flux from chip at the end of job

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